7+ Sputtering Target Backing Plate

Web 2Backing Plates Sputtering Targets Materion Electronic Materials. ASTM A36 steel is a common grade of low carbon steel with.

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A material can transfer heat through its thickness faster when the material is thinner.

. The backing plate is used to cool the target. 2 make sure that the backing plate has good thermal. Web Claimed is a sputtering target system comprising a plurality of backing plates 2 3 4 to be individually cooled.

Web Order with the Target app and well load it into your car. For most sputtering RD guns the thickness of the. Web The metal target material that evaporates when sputtering is very hot so it cools and proceeds with the production process.

Web method for a backing plate that can reduce displacement of the groove. Web We will arrange the delivery of your steel plate in Houston according to your preference pick it up or we will deliver it as quickly as possible even same-day or. Planar Plasmaterials Inc manufactures a complete line of backing plates for almost every commercially available sputtering cathodic arc ion deposition.

Web 1 The backing plate must adhere well to the target while also providing good electrical contact. Web Shop Target Houston North Central Store for furniture electronics clothing groceries home goods and more at prices you will love. Web Depending on the target characterization and backing plate material a specific solder is chosen to optimize the bond.

Web backing plate composite material aluminum alloy ceramic sputtering target Prior art date 2000-11-21 Legal status The legal status is an assumption and is not a legal conclusion. Web Benefits of Bonding Sputtering Targets. 3Bonding for Sputtering and Backing Plates Plasmaterials Inc.

Each backing plate 2 3 4 is provided on its back side with a. Order ahead and well have it waiting for you at the store. Web Machined from oxygen-free high-conductivity copper.

Web ASTM A36 is Recommended for. For regular circular disc-type sputtering sources. General construction industrial and commercial buildings cabinets and enclosures.

Web We routinely provide backing plates copper molybdenum copper-chromium for planar circular and cylindrical sputtering targets conductive pastes and pads for sputter target. Attention is paid to the difference between the thermal. Most sputter sources accept a 0125 18 thick target bonded to a.

The present invention relates to a production method for a backing plate comprising joining a plate.

Sputtering Target Evaporation Materials Global Manufacturer Sam

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Backing Plate An Overview Sciencedirect Topics

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